SPHERETEK® NEXT GENERATION MICROBALL WAFER BUMPING
SPHERETEK® SOLDER TRANSFER SUBSTRATE WITH OPTIONAL BURN IN
Spheretek’s next generation solder microsphere transfer substrates are patterned using the Spheretek patented solder bump transfer technology. This process creates solder balls ready to be transferred to any underbump metallized wafer or substrate material. Sizes start from 50µ (0.002). using a Patented Mask Interference Process, Spheretek® creates a consistent, bright, shiny, perfect solder sphere on a transfer substrate for integrated interconnection production requirements supporting wafer level packaging,WLCSP,CSP (Chip Scale Package), Flip Chip CSP, Flip Chip and BGA production.With the optional Burn In capability Spheretek can bring your bumped product to the saw already completed burn-in.
· Standard sizes available from 50µ to 1250µ diameters
· Guaranteed uniformity of spheres to ±20µ -6.35 tolerance
· Shiny, visible surface for automated handling
· Any available metallurgy
– Traditional alloys
– RoHS compliant alloys
· Custom sizes can be made to support specific current density,and thermal path requirements in production volumes.
· Lowest cost, highest quality product available in the market
· Patents pending
· No major equipment investment.
· Solder bumps can be virtually any size or shape you require ready to transfer to your underbumped metallized wafer or substrate.
· Shaping the solder can be used for interconnect and thermal strain relief
HOW TO GET STARTED
Step One:Provide with your Bump or Bond Pad Plot, CAD or other layout file with the pad pattern, Spheretek will create a bumped solder transfer substrate.Just specify the bump you require to be added to your wafer or substrate.
Step Two: Spheretek will create a mirrored transfer substrate with the specified bumps on it.
Step Three: Spheretek will align the mirrored transfer substrate with your wafer or other metallized underbumped substrate to be bumped.
Step Four: Spheretek will heat the substrate and bumps will be transferred and ready to be sawn.
Spheretek can saw and package your die as required.
BURN IN OPTION
Spheretek offers a burn in option where burn in connectors are plated onto the transfer substrate. Once completed the wafer is reflowed and separated from the substrate leaving a wafer that has been burned in and bumped.
If space allows full testing of the die can be done on the wafer through the connections with the solder bumps.Once completed the wafer is reflowed and separated from the substrate for a wafer of Known Good Die.
SPHERETEK UNDER BUMP METAL (UBM)
Create a good bump for interconnect requires
proper UBM. If your wafer or substrate doesn’t come with a metal that is proper
to make a good molecular metal bond to the solder, Spheretek offers a service
to build a metal structure over your bond pads.
SPHERETEK EQUIPMENT OPTIONS:
Transfer Substrate Station
Wafer Bumping Station
Ask us for Solder Ball manufacturing and Wafer
Bumping Equipment Data Sheet
Spheretek LLC DIV of MVM Technologies Inc 650 283 9509 Toll Free: 877 863 0103 1206E Mountain View Alviso Road Sunnyvale, CA 94089 email@example.com