Solder ball transfer substrate
 

SPHERETEK® NEXT
GENERATION MICROBALL WAFER BUMPING

SPHERETEK® SOLDER
TRANSFER SUBSTRATE WITH OPTIONAL BURN IN

Spheretek’s next generation solder microsphere transfer substrates are patterned using the
Spheretek patented solder bump transfer technology. This process
creates solder balls ready to be transferred  to any underbump metallized
wafer
or substrate material.  Sizes start from
50µ (0.002). using a Patented Mask
Interference Process, Spheretek
® creates a consistent, bright, shiny, perfect solder sphere on a transfer
substrate for integrated interconnection production requirements supporting
wafer level packaging,  WLCSP,  CSP
(Chip
Scale Package), Flip Chip CSP, Flip Chip
and BGA
production.  With the optional Burn In
capability Spheretek can bring your bumped product to the saw already completed
burn-in.



Features: 

·        
Standard sizes
available from 50µ to 1250µ diameters

·        
Guaranteed uniformity of spheres to ±20µ -6.35 tolerance

·        
Shiny, visible
surface for automated handling

·        
Any available
metallurgy

        
Traditional alloys

        
RoHS compliant
alloys

·        
Custom sizes can
be made to support specific current density,and thermal path requirements in
production volumes.

·        
Lowest cost,
highest quality product available in the market

·        
Patents pending

·        
No major equipment investment.

·        
Solder bumps can be virtually any size or shape you require
ready to transfer to your underbumped metallized wafer or substrate. 

·       
Shaping the solder can be used for interconnect and thermal
strain relief

 

HOW TO GET STARTED
 Step One:  Provide with your Bump or Bond Pad Plot, CAD
or other layout file with the pad pattern, Spheretek will create a bumped
solder transfer substrate.  Just specify
the bump you require to be added to your wafer or substrate.
Step Two: 
Spheretek will create a mirrored transfer substrate with the specified
bumps on it. 
Step Three: Spheretek will align the mirrored
transfer substrate with your wafer or other metallized underbumped substrate to
be bumped.
Step Four: 
Spheretek will heat the substrate and bumps will be transferred and
ready to be sawn.
Spheretek can saw and package your die as required.


BURN IN OPTION
Spheretek offers a burn in option where burn in
connectors are plated onto the transfer substrate. Once completed the wafer is
reflowed and separated from the substrate leaving a wafer that has been burned
in and bumped.
If
space allows full testing of the die can be done on the wafer through the
connections with the solder bumps.  Once
completed the wafer is reflowed and separated from the substrate for a wafer of
Known Good Die.
 

SPHERETEK UNDER BUMP METAL (UBM)

Create a good bump for interconnect requires
proper UBM. If your wafer or substrate doesn’t come with a metal that is proper
to make a good molecular metal bond to the solder, Spheretek offers a service
to build a metal structure over your bond pads.


SPHERETEK EQUIPMENT OPTIONS:


Transfer Substrate Station 

 
Wafer Bumping Station 
Ask us for Solder Ball manufacturing and Wafer
Bumping Equipment Data Sheet



Spheretek LLC DIV of MVM Technologies Inc
 650 283 9509 Toll Free: 877 863 0103
1206E Mountain View Alviso Road
Sunnyvale, CA 94089
gary@mvmtech.com




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