Spheretek’s®Precision Wafer Bumping Technology and manufacturing process offers true WLCSP-sized precision spheres of 50µ (0.002). Featuring a Screen Printed Captured Cell Technology andusing a Patented Mask Interference Process, Spheretek® creates a consistent, bright, shiny, perfect solder sphere for integrated interconnection production requirements supporting wafer level packaging,WLCSP, CSP (Chip Scale Package), Flip Chip CSP, Flip Chip and BGA production.
Standard sizes available from 50µ to 1250µ diameters
Guaranteed uniformity of spheres to ±20µ -6.35 tolerance
Shiny, visible surface for automated handling
Any available metallurgy
– RoHS compliant alloys
Custom sizes can be made to support specific current density and thermal path requirements in production volume
Lowest cost, highest quality product available in the market
Microns ± 5%
Pure metal spheres are offered in the alloys below: If there is a special alloy required please allow us to prepare a solder sphere to your special requirements.
Part NumberS_ _ _ _ - _ _ _
S6337 - _ _ _
S6236 - _ _ _
S9635 -_ _ _
S9653 -_ _ _
S____ -_ _ _
Sealed 2 oz. and 6 oz. ESD Containers.
Custom packaging is available based on customer needs,
. An inert argon atmosphere is available on request.
Storage and Handling:
Clean and dry environments are required for solder sphere storage.
Caution: Probing of solder spheres in containers with fingers or other implements can damage the solder sphere by changing its shape, scoring its surface or contaminating its surface with skin oils. Shelf life of all solder spheres, stored in sealed ESD containers that are not agitated, is 2 years.
Products storage environment:
Temperature:25 ±5 ℃ Humidity:60 ± 20 %RH
Technical Support: Call 877-863-0103
Health & Safety
This product, during handling or use, may be hazardous to health or the environment.Read the Material Safety Data Sheet.
Recommended Profile A:
This profile was designed to serve as a starting for process optimization. A cool down rate of2 -4 ºC per second is ideal for the formation of a fine grain structure without risking damage to thermally sensitive components.
Recommended Profile B
This profile is designed to serve as a starting point for Sn96.5/Ag3.0/Cu0.5. A cool down rate of
2-4 ºC per second is ideal for the formation of a fine grain structure without risking damage to sensitive components.