Spheretek®



           



SPHERETEK® SOLDER SPHERES



 



 











Spheretek’s®  Precision Wafer Bumping Technology and
manufacturing process offers true WLCSP-sized precision spheres of
50µ (0.002). Featuring a Screen Printed Captured Cell Technology
and  using a Patented Mask
Interference Process, Spheretek
® creates a consistent,
bright, shiny, perfect solder sphere for integrated interconnection
production requirements supporting wafer level packaging,  WLCSP, 
CSP
(Chip Scale Package), Flip Chip CSP, Flip Chip and BGA production.



Features:


 


 


  • Standard sizes available from 50µ to 1250µ diameters
  • Guaranteed uniformity of
    spheres to
    ±20µ -6.35 tolerance
  • Shiny, visible surface for automated handling
  • Any available metallurgy

                    Traditional
alloys


                    
RoHS compliant alloys


  • Custom sizes can be made to support specific current
    density and thermal path requirements in production volume
  • Lowest cost, highest quality product available in the
    market
  • Patents pending

 




 







































































































Typical


Mils



Diameters:


Microns ± 5%



Quantity


2oz



/Jar


6oz



35.0



889



 



250,000



30.0



762



 



340000



25.0



635



325,000



 



20.0



508



650,000



 



18.0



457.2



1,250,000



 



16.0



406.4



1,900,000



 



14.0



355.6



3,000,000



 



12.0



304.8



3,000,000



 



10.0



254



3,000,000



 



8.0



203.2



3,000,000



 



6.0



152.4



3,000,000



 



4.0



101.6



3,000,000



 



3.14



80



3,000,000



 



2.36



60



3,000,000



 



1.96



50



3,000,000



 






 







 



 



Available
Alloys:



Pure
metal spheres are offered in the alloys below: 
If there is a special alloy required please allow us to prepare a solder
sphere to your special requirements. 



 



Part numbering:



                               











Part Number  S_ _ _ _ - _ _ _



                           Solder Alloy   Size  




 



 















Solder Alloys



Melting Temperatures



Part No.



  1. Sn63/Pb37
  2. Sn62/Pb36/Ag2:
  3. Sn96.5/Ag3.5
  4. Sn96.5/Ag3/Cu0.5
  5. Custom

 



Sn63/Pb37: 183C;


Sn62/Pb36/Ag2: 179C;


Sn96.5/Ag3.5: 221C;


Sn96.5/Ag3/Cu0.5: 217-219C



S6337 - _ _ _


S6236 - _ _ _


S9635 -  _ _ _


S9653 -  _ _ _


S____ -  _ _ _




 



Packaging:



Sealed
2 oz. and 6 oz. ESD
Containers.



Custom packaging is available
based on customer needs,



. An inert argon atmosphere is available on request.



 



Storage and Handling:



Clean
and dry environments are required for solder sphere storage.



Caution: Probing of solder spheres in containers with fingers or
other implements can damage the solder sphere by changing its shape, scoring
its surface or contaminating its surface with skin oils. Shelf life of all
solder spheres, stored in sealed ESD containers that are not agitated, is 2
years.



 



Products storage environment:



Temperature:  25 ±5        
Humidity:  60 ± 20 %RH



Technical Support:  Call
877-863-0103



Health &
Safety



This product,
during handling or use, may be hazardous to health or the environment.  Read the Material Safety Data Sheet.







 



Recommended Profile A:



 



This profile was designed to serve as a
starting for process optimization. A cool down rate of  2 -4 ºC per second is ideal for the
formation of a fine grain structure without risking damage to thermally
sensitive components.



 







 





 



Recommended Profile B



This profile is designed to serve as a starting point for
Sn96.5/Ag3.0/Cu0.5. A cool down rate of



2-4 ºC per second is ideal for the formation of a fine grain
structure without risking damage to sensitive components.



 



 



 



 



 



                                                                                                             



                                                                                                             



                                                                                                             



 






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